Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Articles
Mechanical integrity of back-end-of-Line with Ru nanowires and airgaps
Publication:
Mechanical integrity of back-end-of-Line with Ru nanowires and airgaps
Copy permalink
Date
2020
Journal article
https://doi.org/10.1016/j.microrel.2020.113700
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Zahedmanesh, Houman
;
Vanstreels, Kris
Journal
Microelectronics Reliability
Abstract
Description
Metrics
Views
1936
since deposited on 2021-10-29
Acq. date: 2025-12-15
Citations
Metrics
Views
1936
since deposited on 2021-10-29
Acq. date: 2025-12-15
Citations