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The evaluation and the inegration of low-k organic spin-on materials in a non-etchback interconnect process
Publication:
The evaluation and the inegration of low-k organic spin-on materials in a non-etchback interconnect process
Date
1996
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Meynen, Herman
;
Waeterloos, Joost
;
Coenegrachts, Bart
;
Gao, Teng
;
Grillaert, Joost
;
Van den hove, Luc
Journal
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1989
since deposited on 2021-09-29
Acq. date: 2025-10-24
Citations
Metrics
Views
1989
since deposited on 2021-09-29
Acq. date: 2025-10-24
Citations