Publication:

New approach to apply 1,2,3-benzotriazole as a capping layer on UBMs for 3D TCB stacking and investigation of oxidation protection and solder wetting

Date

2019
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dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorShehzad, Adil
dc.contributor.authorWunderle, Benhard
dc.contributor.authorHou, Lin
dc.contributor.authorSuhard, Samuel
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T08:44:37Z
dc.date.available2021-10-27T08:44:37Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32874
dc.identifier.urlhttp://www.empc2019.org/program/overview.html
dc.source.conference22nd EMPC2019 Electronic Packaging conference
dc.source.conferencedate16/09/2019
dc.source.conferencelocationPisa Italy
dc.title

New approach to apply 1,2,3-benzotriazole as a capping layer on UBMs for 3D TCB stacking and investigation of oxidation protection and solder wetting

dc.typeOral presentation
dspace.entity.typePublication
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