Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
Solving technical and cconomical barriers to the adoption of through-Si-via 3D integration technologies
Publication:
Solving technical and cconomical barriers to the adoption of through-Si-via 3D integration technologies
Copy permalink
Date
2008
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
17754.pdf
6.47 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Beyne, Eric
Journal
Abstract
Description
Metrics
Views
1747
since deposited on 2021-10-17
2
last month
Acq. date: 2025-12-16
Citations
Metrics
Views
1747
since deposited on 2021-10-17
2
last month
Acq. date: 2025-12-16
Citations