Publication:
Process Window Enhancement of Via Holes for Fine Pitch RDL by Design Optimization
| dc.contributor.author | Slabbekoorn, John | |
| dc.contributor.imecauthor | Slabbekoorn, John | |
| dc.contributor.orcidimec | Phommahaxay, Alain::0000-0001-8672-2386 | |
| dc.date.accessioned | 2022-09-20T12:21:33Z | |
| dc.date.available | 2021-11-02T16:04:46Z | |
| dc.date.available | 2022-09-20T12:21:33Z | |
| dc.date.issued | 2020-06 | |
| dc.identifier.doi | 10.1109/ECTC32862.2020.00179 | |
| dc.identifier.eisbn | 978-1-7281-6180-8 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38156 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 1114 | |
| dc.source.conference | 70th IEEE Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | JUN 03-30, 2020 | |
| dc.source.conferencelocation | america | |
| dc.source.endpage | 1119 | |
| dc.source.journal | ectc | |
| dc.source.numberofpages | 6 | |
| dc.title | Process Window Enhancement of Via Holes for Fine Pitch RDL by Design Optimization | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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