Publication:

Integration of vertical carbon nanotube bundles for interconnects

Date

2009
Proceedings Paper
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dc.contributor.authorChiodarelli, Nicolo
dc.contributor.authorKellens, Kristof
dc.contributor.authorCott, Daire
dc.contributor.authorPeys, Nick
dc.contributor.authorArstila, Kai
dc.contributor.authorHeyns, Marc
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorGroeseneken, Guido
dc.contributor.authorVereecken, Philippe
dc.contributor.imecauthorKellens, Kristof
dc.contributor.imecauthorCott, Daire
dc.contributor.imecauthorHeyns, Marc
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.accessioned2021-10-17T21:34:59Z
dc.date.available2021-10-17T21:34:59Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15093
dc.source.beginpage11
dc.source.conferenceElectrochemical Processing in ULSI and MEMS 4
dc.source.conferencedate24/05/2009
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage24
dc.title

Integration of vertical carbon nanotube bundles for interconnects

dc.typeProceedings paper
dspace.entity.typePublication
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