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Keeping the HEMT cool withdiamond: thermal and structural interface characterization
Publication:
Keeping the HEMT cool withdiamond: thermal and structural interface characterization
Date
2016
Presentation
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ramaneti, Rajesh
;
Korneyschuk, S.
;
Zhou, Y.
;
Körner, C.
;
Liu, X.
;
Anaya Calvo, J.
;
Pobedinskas, Paulius
;
Derluyn, J.
;
Fahlman, M.
;
Verbeeck, J.
;
Kuball, M.
;
Haenen, Ken
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2044
since deposited on 2021-10-23
Acq. date: 2025-10-24
Citations
Metrics
Views
2044
since deposited on 2021-10-23
Acq. date: 2025-10-24
Citations