Publication:

Temporary bonding for high-topography applications: spin-on material versus dry film

Date

2014
Proceedings Paper
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dc.contributor.authorJourdain, Anne
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorGuerrero, Alice
dc.contributor.authorBailey, Susan
dc.contributor.authorPrivett, Mark
dc.contributor.authorArnold, Kim
dc.contributor.authorMiller, Andy
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorGuerrero, Alice
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T02:24:06Z
dc.date.available2021-10-22T02:24:06Z
dc.date.embargo9999-12-31
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24018
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6897393&contentType=Conference+Publications
dc.source.beginpage894
dc.source.conferenceIEEE 64th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate27/05/2014
dc.source.conferencelocationOrlando, FL USA
dc.source.endpage898
dc.title

Temporary bonding for high-topography applications: spin-on material versus dry film

dc.typeProceedings paper
dspace.entity.typePublication
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