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Multilayer thin film technology - Enabling technology for SiP and "above-IC" heterogeneous SOC solutions

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dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-16T00:46:18Z
dc.date.available2021-10-16T00:46:18Z
dc.date.issued2005-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10099
dc.source.conferenceProceedings of the Encast International Workshop - CAST. "Challenges for Advanced Semiconductor-Die Technologies"
dc.source.conferencedate16/05/2005
dc.source.conferencelocationBarcelona Spain
dc.title

Multilayer thin film technology - Enabling technology for SiP and "above-IC" heterogeneous SOC solutions

dc.typeProceedings paper
dspace.entity.typePublication
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