Publication:

Reliability Challenges in Advanced 3D Technologies: The Case of Through Silicon Vias and SiCN-SiCN Wafer-to-Wafer Hybrid-Bonding Technologies

Date

2023
Journal article
https://doi.org/10.1109/TDMR.2023.3327664
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dc.contributor.authorChery, Emmanuel
dc.contributor.authorFohn, Corinna
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorChery, Emmanuel
dc.contributor.imecauthorFohn, Corinna
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecChery, Emmanuel::0000-0002-2526-3873
dc.contributor.orcidimecFohn, Corinna::0000-0002-6182-0147
dc.contributor.orcidimecDe Messemaeker, Joke::0000-0002-4872-0176
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2024-03-12T10:58:52Z
dc.date.available2024-01-15T17:08:10Z
dc.date.available2024-03-12T10:58:52Z
dc.date.issued2023
dc.identifier.doi10.1109/TDMR.2023.3327664
dc.identifier.issn1530-4388
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43422
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage615
dc.source.endpage622
dc.source.issue4
dc.source.journalIEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
dc.source.numberofpages8
dc.source.volume23
dc.subject.keywordsDIELECTRICS
dc.subject.keywordsBREAKDOWN
dc.title

Reliability Challenges in Advanced 3D Technologies: The Case of Through Silicon Vias and SiCN-SiCN Wafer-to-Wafer Hybrid-Bonding Technologies

dc.typeJournal article
dspace.entity.typePublication
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