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Improved Capacitive Memory Window for Non-destructive Read in HZO-based Ferroelectric Capacitors with Incorporation of Semiconducting IGZO

 
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dc.contributor.authorMukherjee, Shankha
dc.contributor.authorBizindavyi, Jasper
dc.contributor.authorClima, Sergiu
dc.contributor.authorXiang, Yang
dc.contributor.authorPopovici, Mihaela Ioana
dc.contributor.authorBelmonte, Attilio
dc.contributor.authorIzmailov, Roman
dc.contributor.authorStiers, Jimmy
dc.contributor.authorKruv, Anastasiia
dc.contributor.authorSubhechha, Subhali
dc.contributor.authorDekkers, Harold
dc.contributor.authorKar, Gouri Sankar
dc.contributor.authorDe, Gourab
dc.contributor.authorRonchi, Nicolo
dc.contributor.authorBelkhiri, Z.
dc.contributor.authorVan den Bosch, Geert
dc.contributor.authorRosmeulen, Maarten
dc.contributor.authorCatthoor, Francky
dc.contributor.authorYu, S.
dc.contributor.authorAfanasiev, Valeri
dc.date.accessioned2026-04-21T09:39:29Z
dc.date.available2026-04-21T09:39:29Z
dc.date.createdwos2026-03-18
dc.date.issued2024
dc.description.abstractRealization of a robust non-destructive read oper-ation (NDRO) in a dense, energy-efficient, BEOL-compatible non-volatile memory device is highly desirable for RAM applications. Though the capacitive memory window (CMW) in ferroelectric (FE) capacitors (FeCAPs) has been shown to enable a NDRO, it is currently insufficient to meet the target application requirements. In this work, we show that the CMW can be significantly improved by integrating a semi-conductor (SC) layer into a FeCAP such that the FE polarization controls the electron density and hence the capacitive response of the SC layer. We experimentally demonstrate this by adding a SC IGZO to a BEOL-compatible HZO-based FeCAP. By further optimizing the IGZO layer (thickness and composition), the IGZO/electrode interface, and enhancing the FE response of the HZO, we achieve a record high CMW ~2.63 μF/cm2 for NDRO. Moreover, we demonstrate the first CMW in scalable 3D memory devices in a NAND array con-figuration with vertically integrated IGZO/HZO layers.
dc.identifier.doi10.1109/iedm50854.2024.10873459
dc.identifier.issn2380-9248
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59142
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE
dc.source.conferenceIEEE International Electron Devices Meeting (IEDM)
dc.source.conferencedate2024-12-07
dc.source.conferencelocationSan Francisco
dc.source.journal2024 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, IEDM
dc.source.numberofpages4
dc.title

Improved Capacitive Memory Window for Non-destructive Read in HZO-based Ferroelectric Capacitors with Incorporation of Semiconducting IGZO

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2026-04-07
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-04-07
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