Publication:

Stress analysis on ultra thin ground wafers

Date

2007-09
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorCotrin Teixeira, Ricardo
dc.contributor.authorDe Munck, Koen
dc.contributor.authorDe Moor, Piet
dc.contributor.authorBaert, Kris
dc.contributor.authorSwinnen, Bart
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorKnüttel, Alexsander
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorVan Hoof, Chris
dc.date.accessioned2021-10-16T15:23:52Z
dc.date.available2021-10-16T15:23:52Z
dc.date.embargo9999-12-31
dc.date.issued2007-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11907
dc.source.beginpage113
dc.source.conferenceMicroelectronics Technology and Devices - SBMICRO
dc.source.conferencedate3/09/2007
dc.source.conferencelocationRio de Janeiro Brazil
dc.source.endpage121
dc.title

Stress analysis on ultra thin ground wafers

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
14678.pdf
Size:
847.34 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions