Publication:

Multi-project wafers for flexible thin-film electronics by independent foundries

Date

2024
Journal article
https://doi.org/10.1038/s41586-024-07306-2
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dc.contributor.authorCeliker, Hikmet
dc.contributor.authorDehaene, Wim
dc.contributor.authorMyny, Kris
dc.contributor.imecauthorCeliker, Hikmet
dc.contributor.imecauthorDehaene, Wim
dc.contributor.imecauthorMyny, Kris
dc.contributor.orcidimecCeliker, Hikmet::0000-0001-8429-0153
dc.contributor.orcidimecDehaene, Wim::0000-0002-6792-7965
dc.contributor.orcidimecMyny, Kris::0000-0002-5230-495X
dc.date.accessioned2024-10-09T09:13:03Z
dc.date.available2024-08-04T17:39:26Z
dc.date.available2024-10-09T09:13:03Z
dc.date.embargo2024-04-24
dc.date.issued2024
dc.description.wosFundingTextWe thank PanelSemi (a system-on-film foundry service provider in Taiwan) for providing LTPS panels and Pragmatic for providing IGZO wafers as a verification of our designs, using their foundry-mode panel and wafer delivery services. Part of this work has received funding under the Horizon Europe programme from the European Research Council under grant agreement no. 101088591 'ORISON project'. Views and opinions expressed are, however, those of the authors only and do not necessarily reflect those of the European Union or the European Research Council. Neither the European Union nor the granting authority can be held responsible for them.
dc.identifier.doi10.1038/s41586-024-07306-2
dc.identifier.issn0028-0836
dc.identifier.pmidMEDLINE:38658759
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44267
dc.publisherNATURE PORTFOLIO
dc.source.beginpage335
dc.source.endpage340
dc.source.issue8011
dc.source.journalNATURE
dc.source.numberofpages7
dc.source.volume629
dc.subject.keywordsTRANSISTORS
dc.title

Multi-project wafers for flexible thin-film electronics by independent foundries

dc.typeJournal article
dspace.entity.typePublication
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