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Thiol based self-assenbled monolayers (SAMs) as an alternative surface finish for 3D Cu microbumps
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Thiol based self-assenbled monolayers (SAMs) as an alternative surface finish for 3D Cu microbumps
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Date
2015
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Armini, Silvia
;
Vandelaer, Yannick
;
Lesniewska, Alicja
;
Cherman, Vladimir
;
De Preter, Inge
;
Inoue, Fumihiro
;
Derakhshandeh, Jaber
;
Vakanas, George
;
Beyne, Eric
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1850
since deposited on 2021-10-22
Acq. date: 2025-12-12
Citations
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Views
1850
since deposited on 2021-10-22
Acq. date: 2025-12-12
Citations