Publication:

Rinsing and drying issues during the post CMP cleaning process

Date

2004
Proceedings Paper
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dc.contributor.authorFyen, Wim
dc.contributor.authorXu, Kaidong
dc.contributor.authorVan Steenbergen, Jan
dc.contributor.authorVereecke, Guy
dc.contributor.authorVos, Rita
dc.contributor.authorArnauts, Sophia
dc.contributor.authorRip, Jens
dc.contributor.authorKenis, Karine
dc.contributor.authorHolsteyns, Frank
dc.contributor.authorHellin, David
dc.contributor.authorDoumen, Geert
dc.contributor.authorMertens, Paul
dc.contributor.authorKraus, Harald
dc.contributor.authorLee, Kim
dc.contributor.imecauthorVan Steenbergen, Jan
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorArnauts, Sophia
dc.contributor.imecauthorRip, Jens
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.imecauthorHellin, David
dc.contributor.imecauthorDoumen, Geert
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.accessioned2021-10-15T13:29:59Z
dc.date.available2021-10-15T13:29:59Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8934
dc.source.beginpage112
dc.source.conference21st International VLSI Multilevel Interconnection Conference - VMIC
dc.source.conferencedate30/09/2004
dc.source.conferencelocationWaikoloa Beach, HI USA
dc.source.endpage119
dc.title

Rinsing and drying issues during the post CMP cleaning process

dc.typeProceedings paper
dspace.entity.typePublication
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