Publication:
Thermo-mechanical reliability of electronic packages
Date
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.date.accessioned | 2021-10-20T11:14:53Z | |
| dc.date.available | 2021-10-20T11:14:53Z | |
| dc.date.issued | 2012 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/20733 | |
| dc.source.conference | The Ultimate Innovation Day | |
| dc.source.conferencedate | 4/10/2012 | |
| dc.source.conferencelocation | Eindhoven Netherland | |
| dc.title | Thermo-mechanical reliability of electronic packages | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
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