Publication:
CMP processing of high-mobility channel material alternatives to Si
Date
| dc.contributor.author | Ong, Patrick | |
| dc.contributor.author | Teugels, Lieve | |
| dc.contributor.imecauthor | Ong, Patrick | |
| dc.contributor.imecauthor | Teugels, Lieve | |
| dc.contributor.orcidimec | Ong, Patrick::0000-0002-2072-292X | |
| dc.contributor.orcidimec | Teugels, Lieve::0000-0002-6613-9414 | |
| dc.date.accessioned | 2021-10-23T13:23:16Z | |
| dc.date.available | 2021-10-23T13:23:16Z | |
| dc.date.issued | 2016 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/27096 | |
| dc.source.beginpage | 119 | |
| dc.source.book | Advances in Chemical Mechanical Planarization (CMP) | |
| dc.source.endpage | 136 | |
| dc.title | CMP processing of high-mobility channel material alternatives to Si | |
| dc.type | Book chapter | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |