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Gas leak rate study of MEMS thin film package in different environments

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dc.contributor.authorWang, Bo
dc.contributor.authorDe Coster, Jeroen
dc.contributor.authorWevers, Martine
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorWang, Bo
dc.contributor.imecauthorDe Coster, Jeroen
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-22T08:09:35Z
dc.date.available2021-10-22T08:09:35Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24803
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6962722&contentType=Conference+Publications
dc.source.beginpage1
dc.source.conference5th Electronics System-Integration Technology Conference - ESTC
dc.source.conferencedate16/09/2014
dc.source.conferencelocationHelsinki Finland
dc.source.endpage4
dc.title

Gas leak rate study of MEMS thin film package in different environments

dc.typeProceedings paper
dspace.entity.typePublication
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