Lead-free flip chip: a comparison between lead-free solder and adhesives

dc.contributor.author	Vandecasteele, Bjorn
dc.contributor.author	Vanfleteren, Jan
dc.contributor.author	Manessis, D.
dc.contributor.author	Ostmann, A.
dc.contributor.author	Hagedorn, H.W.
dc.contributor.author	Wiese, J
dc.contributor.imecauthor	Vandecasteele, Bjorn
dc.contributor.imecauthor	Vanfleteren, Jan
dc.contributor.orcidimec	Vanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned	2021-10-16T06:28:57Z
dc.date.available	2021-10-16T06:28:57Z
dc.date.issued	2005-06
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/11450
dc.source.beginpage	434
dc.source.conference	Proceedings of the 15th European Microelectronics and Packaging Conference and Exhibition - EPMC
dc.source.conferencedate	12/06/2005
dc.source.conferencelocation	Brugge Belgium
dc.source.endpage	439
dc.title	Lead-free flip chip: a comparison between lead-free solder and adhesives
dc.type	Proceedings paper
dspace.entity.type	Publication
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