Publication:
On maximizing the compound yield for 3D wafer-to-wafer stacked ICs
Date
| dc.contributor.author | Taouil, Mottaqiallah | |
| dc.contributor.author | Hamdioui, Said | |
| dc.contributor.author | Verbree, Jouke | |
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.date.accessioned | 2021-10-18T22:13:47Z | |
| dc.date.available | 2021-10-18T22:13:47Z | |
| dc.date.issued | 2010-10 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18071 | |
| dc.source.beginpage | 1 | |
| dc.source.conference | IEEE International Test Conference - ITC | |
| dc.source.conferencedate | 31/10/2010 | |
| dc.source.conferencelocation | Austin, TX USA | |
| dc.source.endpage | 10 | |
| dc.title | On maximizing the compound yield for 3D wafer-to-wafer stacked ICs | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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