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Conference contributions
FI-CDM and LICCDM testing on wafer, single die and package levels
Publication:
FI-CDM and LICCDM testing on wafer, single die and package levels
Date
2024
Proceedings Paper
https://doi.org/10.23919/EOS/ESD61719.2024.10702171
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Simicic, Marko
;
Takenaka, Hiroshi
;
Tamura, Shinichi
;
Claes, Dieter
;
Shimada, Yohei
;
Sawada, Masanori
;
Chen, Shih-Hung
Journal
N/A
Abstract
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Views
140
since deposited on 2024-12-01
Acq. date: 2025-10-24
Citations
Metrics
Views
140
since deposited on 2024-12-01
Acq. date: 2025-10-24
Citations