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A quantitative study of the adhesion between copper, barrier and organic low-k polymers
Publication:
A quantitative study of the adhesion between copper, barrier and organic low-k polymers
Date
2000
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Lanckmans, Filip
;
Brongersma, Sywert
;
Varga, Istvan
;
Beyne, Eric
;
Maex, Karen
Journal
Abstract
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1986
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Views
1986
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations