Publication:
Wafer level packaging interconnect technology
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-15T04:01:12Z | |
| dc.date.available | 2021-10-15T04:01:12Z | |
| dc.date.issued | 2003 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/7207 | |
| dc.source.conference | IEDM Short course "From Technology to System Design" | |
| dc.source.conferencedate | 7/12/2003 | |
| dc.source.conferencelocation | Washington DC USA | |
| dc.title | Wafer level packaging interconnect technology | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |