Publication:
A methodology for mechanical stress and wafer warpage minimization during 3D NAND fabrication
| dc.contributor.author | Kruv, Anastasiia | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Okudur, Oguzhan Orkut | |
| dc.contributor.author | Spampinato, Valentina | |
| dc.contributor.author | Franquet, Alexis | |
| dc.contributor.author | Vadakupudhu Palayam, Senthil | |
| dc.contributor.author | Arreghini, Antonio | |
| dc.contributor.author | Van den Bosch, Geert | |
| dc.contributor.author | Rosmeulen, Maarten | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.imecauthor | Kruv, Anastasiia | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Okudur, Oguzhan Orkut | |
| dc.contributor.imecauthor | Spampinato, Valentina | |
| dc.contributor.imecauthor | Franquet, Alexis | |
| dc.contributor.imecauthor | Vadakupudhu Palayam, Senthil | |
| dc.contributor.imecauthor | Arreghini, Antonio | |
| dc.contributor.imecauthor | Van den Bosch, Geert | |
| dc.contributor.imecauthor | Rosmeulen, Maarten | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.orcidimec | Gonzalez, Mario::0000-0003-4374-4854 | |
| dc.contributor.orcidimec | Okudur, Oguzhan Orkut::0000-0002-4790-7772 | |
| dc.contributor.orcidimec | Spampinato, Valentina::0000-0003-3225-6740 | |
| dc.contributor.orcidimec | Franquet, Alexis::0000-0002-7371-8852 | |
| dc.contributor.orcidimec | Arreghini, Antonio::0000-0002-7493-9681 | |
| dc.contributor.orcidimec | Van den Bosch, Geert::0000-0001-9971-6954 | |
| dc.contributor.orcidimec | Rosmeulen, Maarten::0000-0002-3663-7439 | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.contributor.orcidimec | Vadakupudhu Palayam, Senthil::0000-0002-0855-3377 | |
| dc.date.accessioned | 2023-08-07T11:22:06Z | |
| dc.date.available | 2023-06-20T10:36:17Z | |
| dc.date.available | 2023-08-07T11:22:06Z | |
| dc.date.issued | 2022 | |
| dc.description.wosFundingText | This research is supported by imec's Industrial Affiliation Program on Advanced Flash Memory devices. The authors acknowledge the contributions of T. Raymakers and K. Banerjee to this work. | |
| dc.identifier.doi | 10.1016/j.mee.2021.111660 | |
| dc.identifier.issn | 0167-9317 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/41936 | |
| dc.publisher | ELSEVIER | |
| dc.source.beginpage | Art. 111660 | |
| dc.source.endpage | na | |
| dc.source.issue | February | |
| dc.source.journal | MICROELECTRONIC ENGINEERING | |
| dc.source.numberofpages | 4 | |
| dc.source.volume | 254 | |
| dc.subject.keywords | ELASTIC-MODULUS | |
| dc.subject.keywords | THIN-FILM | |
| dc.subject.keywords | SUBSTRATE | |
| dc.title | A methodology for mechanical stress and wafer warpage minimization during 3D NAND fabrication | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
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