Publication:
Broadband modeling and transient analysis of MCM interconnections
Date
| dc.contributor.author | Peeters, Joris | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.date.accessioned | 2021-09-29T12:45:17Z | |
| dc.date.available | 2021-09-29T12:45:17Z | |
| dc.date.issued | 1994 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/293 | |
| dc.source.beginpage | 153 | |
| dc.source.endpage | 160 | |
| dc.source.issue | 2 | |
| dc.source.journal | IEEE Trans. Components, Packaging and Manufacturing Technology. Part B: Advanced Packaging | |
| dc.source.volume | 17 | |
| dc.title | Broadband modeling and transient analysis of MCM interconnections | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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