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Increasing DOF for VIA lithography using a non-CMP based architecture

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dc.contributor.authorGrozev, Grozdan
dc.contributor.authorWaeterloos, Joost
dc.contributor.authorRonse, Kurt
dc.contributor.authorVan den hove, Luc
dc.contributor.authorTzviatkov, Plamen
dc.contributor.imecauthorGrozev, Grozdan
dc.contributor.imecauthorRonse, Kurt
dc.contributor.imecauthorVan den hove, Luc
dc.date.accessioned2021-09-30T08:21:13Z
dc.date.available2021-09-30T08:21:13Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1905
dc.source.beginpage249
dc.source.conferenceProceedings Interface '97 Microlithography Symposium;
dc.source.conferencelocation
dc.source.endpage257
dc.title

Increasing DOF for VIA lithography using a non-CMP based architecture

dc.typeProceedings paper
dspace.entity.typePublication
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