Flip-chip assembly for chips with gold bumps on high density thic film substrates

dc.contributor.author	Vrana, M.
dc.contributor.author	Van Calster, Andre
dc.contributor.author	Van den Berghe, R.
dc.contributor.author	Allaert, K.
dc.contributor.imecauthor	Van Calster, Andre
dc.date.accessioned	2021-09-30T10:05:06Z
dc.date.available	2021-09-30T10:05:06Z
dc.date.issued	1997
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/2298
dc.source.beginpage	175
dc.source.conference	Proceedings of the 11th European Microelectronics Conference; 14-16 May 1997. Venice, Italy.
dc.source.conferencelocation
dc.source.endpage	182
dc.title	Flip-chip assembly for chips with gold bumps on high density thic film substrates
dc.type	Proceedings paper
dspace.entity.type	Publication
Files
Publication available in collections:	Conference contributions

Date