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Multi-scale modeling of direct copper plating on resistive non-copper substrates
Publication:
Multi-scale modeling of direct copper plating on resistive non-copper substrates
Date
2012-10
Meeting abstract
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Yang, Liu
;
Radisic, Alex
;
Nagar, Magi
;
Deconinck, Johan
;
Leunissen, Peter
;
Vereecken, Philippe
;
West, Alan
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1927
since deposited on 2021-10-20
Acq. date: 2025-10-23
Citations
Metrics
Views
1927
since deposited on 2021-10-20
Acq. date: 2025-10-23
Citations