Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
Multi-scale modeling of direct copper plating on resistive non-copper substrates
Publication:
Multi-scale modeling of direct copper plating on resistive non-copper substrates
Copy permalink
Date
2012-10
Meeting abstract
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Yang, Liu
;
Radisic, Alex
;
Nagar, Magi
;
Deconinck, Johan
;
Leunissen, Peter
;
Vereecken, Philippe
;
West, Alan
Journal
Abstract
Description
Metrics
Views
1928
since deposited on 2021-10-20
1
last month
Acq. date: 2025-12-10
Citations
Metrics
Views
1928
since deposited on 2021-10-20
1
last month
Acq. date: 2025-12-10
Citations