Publication:

3D DfT architecture for pre-bond and post-bond testing

Date

2010-11
Proceedings Paper
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dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorChi, Chun-Chuan
dc.contributor.authorVerbree, Jouke
dc.contributor.authorKonijnenburg, Mario
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorKonijnenburg, Mario
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.contributor.orcidimecKonijnenburg, Mario::0000-0001-8016-0888
dc.date.accessioned2021-10-18T18:50:33Z
dc.date.available2021-10-18T18:50:33Z
dc.date.issued2010-11
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17584
dc.source.beginpage1
dc.source.conferenceIEEE International 3D Systems Integration Conference - 3DIC
dc.source.conferencedate16/11/2010
dc.source.conferencelocationMünchen Germany
dc.title

3D DfT architecture for pre-bond and post-bond testing

dc.typeProceedings paper
dspace.entity.typePublication
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