Publication:

A low thermal budget pre metal dielectric stack using PECVD and HDP processing

Date

2001
Presentation
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dc.contributor.authorSchaekers, Marc
dc.contributor.authorDe Jaeger, Brice
dc.contributor.authorSleeckx, Erik
dc.contributor.authorDebusschere, Ingrid
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorLauwers, A.
dc.contributor.authorHauf, H.
dc.contributor.imecauthorSchaekers, Marc
dc.contributor.imecauthorDe Jaeger, Brice
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorDebusschere, Ingrid
dc.contributor.orcidimecSchaekers, Marc::0000-0002-1496-7816
dc.contributor.orcidimecDe Jaeger, Brice::0000-0001-8804-7556
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.date.accessioned2021-10-14T17:45:53Z
dc.date.available2021-10-14T17:45:53Z
dc.date.embargo9999-12-31
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5633
dc.source.conference7th International Dielectrics & Conductors for ULSI Multilevel Interconnection Conference (DCMIC) and Exhibition
dc.source.conferencedate5/03/2001
dc.source.conferencelocation
dc.title

A low thermal budget pre metal dielectric stack using PECVD and HDP processing

dc.typeOral presentation
dspace.entity.typePublication
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