Publication:

Polyimide-ALD-polyimide layers as hermetic encapsulant for implants

Date

2017
Proceedings Paper
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dc.contributor.authorSchaubroeck, David
dc.contributor.authorVerplancke, Rik
dc.contributor.authorCauwe, Maarten
dc.contributor.authorCuypers, Dieter
dc.contributor.authorBaumans, Kim
dc.contributor.authorOp de Beeck, Maaike
dc.contributor.imecauthorSchaubroeck, David
dc.contributor.imecauthorVerplancke, Rik
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.imecauthorCuypers, Dieter
dc.contributor.imecauthorBaumans, Kim
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.orcidimecVerplancke, Rik::0000-0002-6642-9454
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.contributor.orcidimecCuypers, Dieter::0000-0003-0550-6273
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.date.accessioned2021-10-24T13:01:21Z
dc.date.available2021-10-24T13:01:21Z
dc.date.embargo9999-12-31
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29386
dc.source.conferenceXXXI International Conference on Surface Modification Technologies - SMT31
dc.source.conferencedate5/07/2017
dc.source.conferencelocationMons Belgium
dc.title

Polyimide-ALD-polyimide layers as hermetic encapsulant for implants

dc.typeProceedings paper
dspace.entity.typePublication
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