Publication:

TSV-assisted hybrid FinFET CMOS - Silicon photonics technology for high density optical I/O

Date

2019
Proceedings Paper
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dc.contributor.authorGuermandi, Davide
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorRakowski, Michal
dc.contributor.authorBan, Yoojin
dc.contributor.authorDe Heyn, Peter
dc.contributor.authorPantano, Nicolas
dc.contributor.authorBex, Pieter
dc.contributor.authorDe Coster, Jeroen
dc.contributor.authorHe, Junwen
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBalakrishnan, Sadhishkumar
dc.contributor.authorDemeurisse, Caroline
dc.contributor.authorBertheau, Julien
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorNolmans, Philip
dc.contributor.authorSun, Xiao
dc.contributor.authorSrinivasan, Ashwyn
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorLardenois, Sebastien
dc.contributor.authorMiller, Andy
dc.contributor.imecauthorGuermandi, Davide
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorRakowski, Michal
dc.contributor.imecauthorBan, Yoojin
dc.contributor.imecauthorDe Heyn, Peter
dc.contributor.imecauthorPantano, Nicolas
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorDe Coster, Jeroen
dc.contributor.imecauthorHe, Junwen
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBalakrishnan, Sadhishkumar
dc.contributor.imecauthorDemeurisse, Caroline
dc.contributor.imecauthorBertheau, Julien
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorSrinivasan, Ashwyn
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorLardenois, Sebastien
dc.contributor.imecauthorMiller, Andy
dc.contributor.orcidimecDe Heyn, Peter::0000-0003-3523-7377
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.date.accessioned2021-10-27T09:51:12Z
dc.date.available2021-10-27T09:51:12Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33065
dc.identifier.urlhttps://ieeexplore.ieee.org/document/9125718
dc.source.beginpageTh.2.A.2
dc.source.conference45th European Conference on Optical Communication - ECOC
dc.source.conferencedate22/09/2019
dc.source.conferencelocationDublin Ireland
dc.title

TSV-assisted hybrid FinFET CMOS - Silicon photonics technology for high density optical I/O

dc.typeProceedings paper
dspace.entity.typePublication
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