Publication:

Process inspection by laser beam scanning of unpatterned wafers

Date

2000
Proceedings Paper
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dc.contributor.authorMertens, Paul
dc.contributor.authorDevriendt, Katia
dc.contributor.authorZeng, Andrew
dc.contributor.authorFyen, Wim
dc.contributor.authorBearda, Twan
dc.contributor.authorVos, Rita
dc.contributor.authorKenis, Karine
dc.contributor.authorArnauts, Sophia
dc.contributor.authorSchmolke, R.
dc.contributor.authorWagner, P.
dc.contributor.authorHeyns, Marc
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorArnauts, Sophia
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecVos, Rita::0000-0003-2610-3406
dc.date.accessioned2021-10-14T14:27:43Z
dc.date.available2021-10-14T14:27:43Z
dc.date.embargo9999-12-31
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4989
dc.source.conferenceSEMICON Europa 2000: European IEEE/SEMI Semiconductor Manufacturing Conference
dc.source.conferencedate3/04/2000
dc.source.conferencelocationMünchen Germany
dc.title

Process inspection by laser beam scanning of unpatterned wafers

dc.typeProceedings paper
dspace.entity.typePublication
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