Publication:

Development of Electrical and Optical Packaging for Silicon Photonic MEMS

Date

2024
Proceedings Paper
https://doi.org/10.1109/IPC60965.2024.10799857
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dc.contributor.authorMallik, Arun Kumar
dc.contributor.authorLee, Jun Su
dc.contributor.authorCollins, Sean
dc.contributor.authorAntony, Cleitus
dc.contributor.authorKhan, Muhammad Umar
dc.contributor.authorEdinger, Pierre
dc.contributor.authorJo, Gaehun
dc.contributor.authorZand, Iman
dc.contributor.authorNiklaus, Frank
dc.contributor.authorGylfason, Kristinn B.
dc.contributor.authorQuack, Niels
dc.contributor.authorBogaerts, Wim
dc.contributor.authorMorissay, Padraic E.
dc.contributor.authorO' Brien, Peter
dc.contributor.imecauthorBogaerts, Wim
dc.contributor.imecauthorKhan, Muhammad Umar
dc.contributor.imecauthorZand, Iman
dc.contributor.orcidimecBogaerts, Wim::0000-0003-1112-8950
dc.contributor.orcidimecKhan, Muhammad Umar::0000-0001-5760-7485
dc.contributor.orcidimecZand, Iman::0000-0001-9857-7331
dc.date.accessioned2025-06-05T09:21:47Z
dc.date.available2025-05-03T05:30:36Z
dc.date.available2025-06-05T09:21:47Z
dc.date.issued2024
dc.description.wosFundingTextThis work has received funding from the European Union's Horizon 2020 research and innovation program under grant agreement No. 780283 (MORPHIC)
dc.identifier.doi10.1109/IPC60965.2024.10799857
dc.identifier.eisbn979-8-3503-6195-7
dc.identifier.isbn979-8-3503-6196-4
dc.identifier.issn2374-0140
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45582
dc.publisherIEEE
dc.source.conference2024 IEEE Photonics Conference
dc.source.conferencedateNOV 10-14, 2024
dc.source.conferencelocationRome
dc.source.journalN/A
dc.source.numberofpages2
dc.title

Development of Electrical and Optical Packaging for Silicon Photonic MEMS

dc.typeProceedings paper
dspace.entity.typePublication
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