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Convolution based compact thermal model: methodology for including the thermal impact of die to die interconnections
Publication:
Convolution based compact thermal model: methodology for including the thermal impact of die to die interconnections
Date
2014
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Maggioni, Federica
;
Oprins, Herman
;
Beyne, Eric
;
De Wolf, Ingrid
;
Baelmans, Tine
Journal
Abstract
Description
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1886
since deposited on 2021-10-22
Acq. date: 2025-10-26
Citations
Metrics
Views
1886
since deposited on 2021-10-22
Acq. date: 2025-10-26
Citations