Publication:
The limitation and optimization of bottom-up growth mode in through silicon via electroplating
Date
| dc.contributor.author | Yang, Liu | |
| dc.contributor.author | Radisic, Alex | |
| dc.contributor.author | Deconinck, Johan | |
| dc.contributor.author | Vereecken, Philippe | |
| dc.contributor.imecauthor | Radisic, Alex | |
| dc.contributor.imecauthor | Vereecken, Philippe | |
| dc.contributor.orcidimec | Vereecken, Philippe::0000-0003-4115-0075 | |
| dc.date.accessioned | 2021-10-23T01:20:07Z | |
| dc.date.available | 2021-10-23T01:20:07Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2015 | |
| dc.identifier.issn | 0013-4651 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/26213 | |
| dc.identifier.url | http://jes.ecsdl.org/content/162/14/D599.full?sid=37180e73-fa95-455b-ae81-4a17a996d13d | |
| dc.source.beginpage | D599 | |
| dc.source.endpage | D604 | |
| dc.source.issue | 14 | |
| dc.source.journal | Journal of the Electrochemical Society | |
| dc.source.volume | 162 | |
| dc.title | The limitation and optimization of bottom-up growth mode in through silicon via electroplating | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | Original bundle
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| Publication available in collections: |