Publication:
Cost-effective 3D-system integration
Date
| dc.contributor.author | Swinnen, Bart | |
| dc.contributor.imecauthor | Swinnen, Bart | |
| dc.date.accessioned | 2021-10-18T03:27:48Z | |
| dc.date.available | 2021-10-18T03:27:48Z | |
| dc.date.issued | 2009 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/16283 | |
| dc.source.conference | Thin Wafer Processing for 3D TSV Applications Workshop | |
| dc.source.conferencedate | 15/07/2009 | |
| dc.source.conferencelocation | San Francisco, CA USA | |
| dc.title | Cost-effective 3D-system integration | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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