Publication:

Thermal mismatch induced reliability issues for Cu filled through-silicon vias

Date

2012
Proceedings Paper
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dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorCroes, Kristof
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorJourdain, Anne
dc.contributor.authorBeyer, Gerald
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-20T10:32:51Z
dc.date.available2021-10-20T10:32:51Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20551
dc.source.conference4th Electronics System Integration Technologies Conference - ESTC
dc.source.conferencedate17/09/2012
dc.source.conferencelocationAmsterdam The Netherlands
dc.title

Thermal mismatch induced reliability issues for Cu filled through-silicon vias

dc.typeProceedings paper
dspace.entity.typePublication
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