Effect of line-overlay and via-misalignment on dielectric reliability for different patterning schemes

dc.contributor.author	Croes, Kristof
dc.contributor.author	Ciofi, Ivan
dc.contributor.author	Kocaay, Deniz
dc.contributor.author	Tokei, Zsolt
dc.contributor.author	Boemmels, Juergen
dc.contributor.imecauthor	Croes, Kristof
dc.contributor.imecauthor	Ciofi, Ivan
dc.contributor.imecauthor	Tokei, Zsolt
dc.contributor.imecauthor	Boemmels, Juergen
dc.contributor.orcidimec	Croes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimec	Ciofi, Ivan::0000-0003-1374-4116
dc.date.accessioned	2021-10-22T01:03:57Z
dc.date.available	2021-10-22T01:03:57Z
dc.date.embargo	9999-12-31
dc.date.issued	2014
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/23691
dc.identifier.url	http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6861118&contentType=Conference+Publications
dc.source.conference	IEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate	1/06/2014
dc.source.conferencelocation	Waikoloa, HI USA
dc.title	Effect of line-overlay and via-misalignment on dielectric reliability for different patterning schemes
dc.type	Proceedings paper
dspace.entity.type	Publication
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