Publication:

Metrology and inspection for process control during bonding and thinning of stacked wafers for manufacturing 3D SIC's

Date

2011
Proceedings Paper
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dc.contributor.authorHalder, Sandip
dc.contributor.authorJourdain, Anne
dc.contributor.authorClaes, Martine
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBeyne, Eric
dc.contributor.authorSwinnen, Bart
dc.contributor.authorPepper, V.
dc.contributor.authorGuittet, P.Y.
dc.contributor.authorSavage, G.
dc.contributor.authorMarkwort, Lars
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecSwinnen, Bart::0000-0002-6878-7124
dc.date.accessioned2021-10-19T14:05:21Z
dc.date.available2021-10-19T14:05:21Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19029
dc.source.beginpage999
dc.source.conferenceIEEE 61st Electronic Components and Technology Conference - ECTC
dc.source.conferencedate1/06/2011
dc.source.conferencelocation
dc.source.endpage1002
dc.title

Metrology and inspection for process control during bonding and thinning of stacked wafers for manufacturing 3D SIC's

dc.typeProceedings paper
dspace.entity.typePublication
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