Publication:
LIDCAT: graded build-up technology for printed circuit boards
Date
| dc.contributor.author | Gielen, An | |
| dc.contributor.author | Vereeken, M. | |
| dc.contributor.author | De Baets, Johan | |
| dc.contributor.author | Morrell, M. | |
| dc.contributor.author | Beadel, M. | |
| dc.contributor.author | Vaudolon, J. | |
| dc.contributor.author | Allard, P. | |
| dc.contributor.author | Blansaer, E. | |
| dc.contributor.author | Colson, P. | |
| dc.contributor.author | Illyefalvi-Vitez, Z. | |
| dc.contributor.author | Gordon, P. | |
| dc.contributor.imecauthor | De Baets, Johan | |
| dc.date.accessioned | 2021-10-15T13:35:34Z | |
| dc.date.available | 2021-10-15T13:35:34Z | |
| dc.date.issued | 2004 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8962 | |
| dc.source.beginpage | 111 | |
| dc.source.conference | Proceedings European Microelectronics and Packaging Symposium | |
| dc.source.conferencedate | 16/06/2004 | |
| dc.source.conferencelocation | Prague Czech Republic | |
| dc.source.endpage | 116 | |
| dc.title | LIDCAT: graded build-up technology for printed circuit boards | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |