Publication:

Analysis of microbump induced stress effects in 3D stacked IC technologies

Date

2012
Proceedings Paper
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dc.contributor.authorIvankovic, Andrej
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorMoroz, V.
dc.contributor.authorChoi, M.
dc.contributor.authorCherman, Vladimir
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorMarchal, Pol
dc.contributor.authorGonzalez, Mario
dc.contributor.authorEneman, Geert
dc.contributor.authorZhang, Wenqi
dc.contributor.authorBuisson, Thibault
dc.contributor.authorDetalle, Mikael
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorVerkest, Diederik
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorVandevelde, Bart
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorVandepitte, Dirk
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorEneman, Geert
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorVerkest, Diederik
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecEneman, Geert::0000-0002-5849-3384
dc.contributor.orcidimecVerkest, Diederik::0000-0001-6567-2746
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-20T11:49:25Z
dc.date.available2021-10-20T11:49:25Z
dc.date.embargo9999-12-31
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20852
dc.source.beginpage9-Apr
dc.source.conferenceIEEE International 3D System Integration Conference - 3DIC
dc.source.conferencedate31/01/2012
dc.source.conferencelocationOsaka Japan
dc.title

Analysis of microbump induced stress effects in 3D stacked IC technologies

dc.typeProceedings paper
dspace.entity.typePublication
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