Publication:
Process optimization and integration of trimethylsilane deposited a-SiC:H and SiOC:H dielectric thin films for damascene processing
Date
Loading...
Journal
Abstract
Description
Metrics
Views
2000 since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Views
2000 since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations