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Process optimization and integration of trimethylsilane deposited a-SiC:H and SiOC:H dielectric thin films for damascene processing
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2006 since deposited on 2021-10-14
3last month
Acq. date: 2026-01-08
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Metrics
Views
2006 since deposited on 2021-10-14
3last month
Acq. date: 2026-01-08
Citations