Publication:

Process technology for the fabrication of a chip-in-wire style packaging

Date

2008-05
Proceedings Paper
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dc.contributor.authorVanden Bulcke, Mathieu
dc.contributor.authorIker, Francois
dc.contributor.authorDe Preter, Inge
dc.contributor.authorMuller, Philippe
dc.contributor.authorSoussan, Philippe
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorBaert, Kris
dc.contributor.imecauthorVanden Bulcke, Mathieu
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorMuller, Philippe
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-17T12:07:59Z
dc.date.available2021-10-17T12:07:59Z
dc.date.embargo9999-12-31
dc.date.issued2008-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14692
dc.source.beginpage303
dc.source.conference58th Electronic Components abd Technology Conference - ECTC
dc.source.conferencedate27/05/2008
dc.source.conferencelocationLake Buena Vista, FL USA
dc.source.endpage308
dc.title

Process technology for the fabrication of a chip-in-wire style packaging

dc.typeProceedings paper
dspace.entity.typePublication
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