Publication:
On the cost-effectiveness of KGD testing for TSV-based 3D-SICs
Date
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Dupas, Luc | |
| dc.contributor.author | Velenis, Dimitrios | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Dupas, Luc | |
| dc.contributor.imecauthor | Velenis, Dimitrios | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-18T00:37:08Z | |
| dc.date.available | 2021-10-18T00:37:08Z | |
| dc.date.issued | 2009-10 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/15828 | |
| dc.source.beginpage | 1 | |
| dc.source.conference | SEMI Known-Good Die Packaging and Test Workshop - KGD | |
| dc.source.conferencedate | 1/10/2009 | |
| dc.source.conferencelocation | Santa Clara, CA USA | |
| dc.source.endpage | 18 | |
| dc.title | On the cost-effectiveness of KGD testing for TSV-based 3D-SICs | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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