Publication:
A new scaled through Si via with polymer fill for 3D wafer level packaging
Date
| dc.contributor.author | Sabuncuoglu Tezcan, Deniz | |
| dc.contributor.author | Duval, Fabrice | |
| dc.contributor.author | Luhn, Ole | |
| dc.contributor.author | Soussan, Philippe | |
| dc.contributor.author | Swinnen, Bart | |
| dc.contributor.imecauthor | Sabuncuoglu Tezcan, Deniz | |
| dc.contributor.imecauthor | Duval, Fabrice | |
| dc.contributor.imecauthor | Soussan, Philippe | |
| dc.contributor.imecauthor | Swinnen, Bart | |
| dc.contributor.orcidimec | Sabuncuoglu Tezcan, Deniz::0000-0002-9237-7862 | |
| dc.contributor.orcidimec | Soussan, Philippe::0000-0002-1347-6978 | |
| dc.date.accessioned | 2021-10-17T10:22:53Z | |
| dc.date.available | 2021-10-17T10:22:53Z | |
| dc.date.issued | 2008 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14409 | |
| dc.source.beginpage | 52 | |
| dc.source.conference | International Conference on Solid State Devices and Materials - SSDM | |
| dc.source.conferencedate | 23/09/2008 | |
| dc.source.conferencelocation | Ibaraki Japan | |
| dc.source.endpage | 53 | |
| dc.title | A new scaled through Si via with polymer fill for 3D wafer level packaging | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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