Publication:
Technology for very dense hybrid detector arrays using electroplated indium solderbumps
Date
| dc.contributor.author | Merken, Patrick | |
| dc.contributor.author | John, Joachim | |
| dc.contributor.author | Zimmermann, Lars | |
| dc.contributor.author | Van Hoof, Chris | |
| dc.contributor.imecauthor | John, Joachim | |
| dc.contributor.imecauthor | Van Hoof, Chris | |
| dc.date.accessioned | 2021-10-15T05:43:30Z | |
| dc.date.available | 2021-10-15T05:43:30Z | |
| dc.date.issued | 2003 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/7897 | |
| dc.source.beginpage | 60 | |
| dc.source.endpage | 64 | |
| dc.source.issue | 1 | |
| dc.source.journal | IEEE Trans. Advanced Packaging | |
| dc.source.volume | 26 | |
| dc.title | Technology for very dense hybrid detector arrays using electroplated indium solderbumps | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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