Publication:

110GHz Through-Silicon Via's Integrated in Silicon Photonics Interposers for Next-Generation Optical Modules

 
dc.contributor.authorMiyaguchi, Kenichi
dc.contributor.authorBan, Yoojin
dc.contributor.authorPantano, Nicolas
dc.contributor.authorSun, Xiao
dc.contributor.authorAbsil, Philippe
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorVerheyen, Peter
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorVan Campenhout, Joris
dc.contributor.imecauthorMiyaguchi, Kenichi
dc.contributor.imecauthorBan, Yoojin
dc.contributor.imecauthorPantano, Nicolas
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorAbsil, Philippe
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorVerheyen, Peter
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.orcidimecMiyaguchi, Kenichi::0000-0002-7073-6457
dc.contributor.orcidimecVerheyen, Peter::0000-0002-8245-9442
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.contributor.orcidimecBan, Yoojin::0000-0001-7319-8132
dc.date.accessioned2022-11-08T08:37:34Z
dc.date.available2022-07-31T02:29:17Z
dc.date.available2022-11-08T08:37:34Z
dc.date.issued2021
dc.identifier.doi10.1109/ECOC52684.2021.9605927
dc.identifier.eisbn978-1-6654-3868-1
dc.identifier.issnna
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40189
dc.publisherIEEE
dc.source.conferenceEuropean Conference on Optical Communication (ECOC)
dc.source.conferencedateSEP 13-16, 2021
dc.source.conferencelocationBordeaux
dc.source.journalna
dc.source.numberofpages4
dc.title

110GHz Through-Silicon Via's Integrated in Silicon Photonics Interposers for Next-Generation Optical Modules

dc.typeProceedings paper
dspace.entity.typePublication
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