Publication:

Trends in wafer-level packaging of MEMS

Date

2003-10
Journal article
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dc.contributor.authorBaert, Kris
dc.contributor.authorDe Moor, Piet
dc.contributor.authorTilmans, Harrie
dc.contributor.authorJohn, Joachim
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Bavel, Mieke
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.imecauthorJohn, Joachim
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Bavel, Mieke
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-15T03:59:41Z
dc.date.available2021-10-15T03:59:41Z
dc.date.issued2003-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7170
dc.source.beginpage48
dc.source.endpage51
dc.source.issueOct.
dc.source.journalOnboard Technology
dc.title

Trends in wafer-level packaging of MEMS

dc.typeJournal article
dspace.entity.typePublication
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