Publication:

Optical metrology based post Cu CMP metal residue detection and characterization

Date

2009
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorLi, Yunlong
dc.contributor.authorTarnowka, Alexandre
dc.contributor.authorEliyahu, Aviv
dc.contributor.authorHeylen, Nancy
dc.contributor.authorDelande, Tinne
dc.contributor.authorFavia, Paola
dc.contributor.authorBender, Hugo
dc.contributor.authorKellens, Kristof
dc.contributor.authorLeunissen, Peter
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorDelande, Tinne
dc.contributor.imecauthorFavia, Paola
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorKellens, Kristof
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecFavia, Paola::0000-0002-1019-3497
dc.date.accessioned2021-10-18T00:01:16Z
dc.date.available2021-10-18T00:01:16Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15712
dc.source.conferenceInternational Conference on Planarization/CMP Technology - ICPT
dc.source.conferencedate19/11/2009
dc.source.conferencelocationFukuoka Japan
dc.title

Optical metrology based post Cu CMP metal residue detection and characterization

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions